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Polising et microscopic propria aurea Alloy sheet coatings ad microelectronic packaging

Gold alloy sheets generally refer to thin sheet materials made of gold alloy used for connecting, fixing or packaging electronic components, etc. Due to the extremely high electrical conductivity, good thermal conductivity, high chemical stability, good flexibility and ductility of gold, the surface of the gold alloy sheets is widely used in microelectronic packaging and the manufacturing of optoelectronic devices after being gold-plated.

To measure the thickness of the coating on the gold alloy sheets, they are now polished for sample preparation: Since the sample size is very small and light in weight, to prevent the sample from floating in the liquid epoxy resin, an X-type sample holder is used for fixation.


Diaphanum tardus, curing epoxy resinae TJ2226 Componatur cum themount pressura frigus embedding apparatus ad frigus embedding, et sample praeparatio est ferri ex in alpha CCVIII Dual-control Dual-pervideo Polising apparatus. Quod specifica gradus sunt, ut sequitur:
I. Plarar stridor cum Silicon Carbide Sandpaper P800 / P1200 / P2000
II. CARUS Polising cum ys pannis pannis III-micron ungue adamantino Polishing Suspensio
III. Finishing Polishing cum et Polising panni I-micron Aluminium Oxide Polising Suspensio


Observatio peragitur per MN80 Metallographic microscope et magnificatus est D temporibus, in griseo coating in sample superficiem potest esse manifeste, cum crassitudine 2-3 μm. Et aurum coating necessitates ad magnificandum ad altiorem magnificationem in Sem spanning electronic microscopio esse visibilis.

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