Sample Praeparatio ad PCB Palladii Aurum Plating Coatings- Trojan (Suzhou) material technology Co., Ltd.

Sample Praeparatio ad PCB Palladii Aurum Plating Coatings

02-06-2026

ENEPIG (Electroless Nickel-Palladium-Gold) stat ut superficies dominans pro fine faciendo PCBs summus. Ni-Pd-Au compacto uniformi triplicem iacuit efficiens, eximius oxidationis & corrosionis resistentia features plus humilitatis contactus resistentiae.

Caudex niger exit ab immersione conventionalis auri, dum solidatorium et compagem pro complexu conventus electronici sustinet.

Figure 1: Cross-sectional metallographic view of the PCB layer structure

Clavis Applications

Semiconductor packaging subiecta: apta Cu / Au filum compages
Automotive ECU & vehiculum radar: anti-inpulsa & repugnant wide temperatus / oleum pollutio
Medicorum accuratio armorum & aerospace PCBs: firmum sub extrema operatione conditionibus
5G stationes basi, altae frequentia-tium & tabularum ambitum HDI; ingens volumen adoptionis

Figure 2: Microscopic inspection of the continue plating quality

Per excellentem vetustatem et processum convenientiae, ENEPIG est consummatio vitalis pro certa certa interconnexione in electronicis premium electronicis.

Figura III: Multi accumsan noctis et instrumenti analysis

Specimen Metallographicum Prep Parameters pro ENEPIG PCB

Molendum: MET-SP P400~P4000
Pulchra politura: SC pallium 1μm PD-WT
Final politura: ZN cloth 50nm SO-439

Figure 4: High-magnification detailed view of ENEPIG coating interface

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