Causa Socius: Semipol ad molendum & poliendum Silicon-Substructio Chip finem facies- Trojan (Suzhou) material technology Co., Ltd.

Causa Socius: Semipol ad molendum & poliendum Silicon-Substructio Chip finem facies

02-12-2025

Objective: Tere et expolire chip finem facie ad speculum perficiendum, prospiciendo finem faciei perpendiculariter et sine ore detracta.
Clavis Provocationes: Astulae silicon-substructio fragiles sunt, magnitudine parvae, et difficiles in praeparatione exempli figere.
Materia: Pii-fundatur chip

Apparatus & Accessories

Apparatus: Semipol summus praecisione stridor et machina expolitio
Accessiones: Tenuis-sheet specimen ascendens fixture

Consumables
Adamas pelliculas lambens (15μm, 9μm, 3μm, 0.5μm)
ZN-ZP tincidunt
AO-W aluminium oxydatum expolitio

Features Semipol Equipment
Semipol est summus praecisio stridor et expolitio fabrica quae potest accuratae semi-automaticae praeparationis specimen pro variis materiis. Maximam molendi facultatem 10mm, resolutionem 1μm, stabilitatem accuratam ±2µm praebet.

Apta est summus praecisio stridor et expolitio circuitionum integralium, lagana semiconductoris, partium opticorum & fibrarum opticorum, exempla petrographica, partium metallicarum praecisio, et alia materia.

Multiplici adfixa ad tractandum instructi stridorem et politionem exemplorum variarum figurarum et magnitudinum.

Praeparatio colui

Molere adamantino cinematographico lapsu (magnitudines particulares: 15μm → 9μm → 3μm → 0.5μm, gradatim expolitio).

Cum tincidunt ZN-ZP tincidunt AO-W, aluminium oxydatum suspensionis poliendi.

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